IEEE USA | Packaging Chips with CHIPS: West Coast Summit

The Packaging Chips with CHIPS: West Coast Summit is a one-day semi summit that will bring together leading thinkers from chip packaging and design companies, along with government policy makers, to discuss the chip packaging industry in light of the historic CHIPS Act and the Materials-to-Fab Center coming to ASU. This event will look at the CHIPS Act from the specific perspective of packaging, with a special focus on the west coast.
 

Keynote speakers are from industry, government and academia to highlight the advanced packaging opportunities for the re-shoring of semiconductor microelectronics. During panel discussions and interactive breakout sessions, attendees and speakers can interact and share their ideas on how to work together to achieve common objectives.